XXVII International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2025)

August 20-22, 2025UCSM, Arequipa – Perú

INTERCON 2025

The 2025 IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing - INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.

Call For paper

Authors are encouraged to submit their research to contribute to the development of technologies that benefit society. The conference aims to bring together researchers, professionals, students, and entrepreneurs to address challenges and promote technological advancements.

Competitions

Will feature various competitions, including robotics, aimed at fostering innovation and collaboration among participants. Details about these contests are available on the official conference website

Speakers

Will feature keynote speeches, technical sessions, and workshops on electronics, electrical engineering, and computing, fostering innovation and collaboration among participants.

Call for Papers

INTERCON (IEEE Peru Section conference) is a renowned IEEE international technical conference which has been conducted in the Peru Section, to bring exciting discoveries, knowledge & understanding together. INTERCON 2024 is the XXXII version of the conference and has been themed inspired by the IEEE Future Directions platforms. Year 2025’s INTERCON is co-organized by UCSM (Universidad Católica Santa María de Arequipa) jointly with its IEEE UCSM Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2025 will continue the footsteps of its predecessors, to serve as a great platform for researchers to discuss and explore advanced technologies in advancing humanity.

Topics (but not limited to)

Topics (but not limited to): INTERCON (Conferencia de la Sección Perú del IEEE)

  • T1. Artificial Intelligence and Machine Learning
  • T2. Communications and Networking
  • T3. Power, Energy, and Power Electronics
  • T4. Biomedical Engineering & Healthcare Technologies
  • T5. Robotics, Control, Instrumentation, and Automation
  • T6. Multimedia Signal Processing and Analytics
  • T7. Devices, Circuits, and Materials
  • T9. Data Science and Computing Technologies
  • T10. Education in Engineering and Technology

Important Dates

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  • Deadline Paper Submission:
    May 5th, 2025
  • Notification of Acceptance:
    June 20th, 2025
  • Camera Ready Submission:
    July 20th, 2025
  • Author Registration:
    July 20th, 2025
  • Conference Opening:
    August 20th, 2025
  • Conference Closing:
    August 22th, 2025

What to submit?
The conference invites research papers of varying length from 6 to 8 pages (including abstract and references) and written in English. The format of the papers is based on IEEE conference template, which can be downloaded from:
https://www.ieee.org/conferences/publishing/templates.html

Publication and Indexing
For all accepted papers, the authors will be asked to sign a copyright transfer on the contents of their paper(s). The accepted papers will be indexed and published on the IEEE Xplore digital library. All papers, only in PDF file, must be submitted electronically through EasyChair:
https://easychair.org/conferences/?conf=2025ieeeintercon

It is important to highlight that the publications from our previous editions of IEEE INTERCON have been indexed by SCOPUS. Requirements for Presentation, Publication, Submission
• One author or at least one of the co-authors must be previously registered in the event to present their work.
• Oral presentation in English is mandatory for the publication of your paper in the IEEE Xplore Digital Library.
• Registrations are only valid after payment.

Contact Us

Address

Universidad Católica Santa María de Arequipa, Urb. San José s/n Umacollo Arequipa – Perú

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