XXXII International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2025)

August 20-22, 2025UCSM, Arequipa - Perú

ABOUT INTERCON 2025

The 2025 IEEE XXXII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students, and entrepreneurs to foster collaboration, address global challenges, and promote the development of technologies that benefit humanity.

INTERCON is a prestigious IEEE technical conference organized by the IEEE Peru Section, recognized for its commitment to innovation and excellence in engineering and computing.

The 2025 edition will be held in person in the city of Arequipa, Peru, and will be co-organized by the Universidad Católica Santa María (UCSM) and its IEEE UCSM Student Branch. This year’s theme draws inspiration from the IEEE Future Directions platforms, with a focus on transformative and emerging technologies.

We warmly invite you to submit your technical papers for oral, on-site presentations. INTERCON 2025 will continue its tradition of providing a vibrant and dynamic platform for knowledge exchange, research dissemination, and collaboration between academia, industry, and innovators—further advancing IEEE’s mission to foster technology for the benefit of humanity.

Topics and Important Dates

Topics (but not limited to)

Topics (but not limited to): INTERCON (Conferencia de la Sección Perú del IEEE)

  • T1. Artificial Intelligence and Machine Learning

  • T2. Communications and Networking

  • T3. Power, Energy, and Power Electronics

  • T4. Biomedical Engineering & Healthcare Technologies

  • T5. Robotics, Control, Instrumentation, and Automation

  • T6. Multimedia Signal Processing and Analytics

  • T7. Devices, Circuits, and Materials

  • T8. Data Science and Computing Technologies

  • T9. Education in Engineering and Technology

Important Dates the Call for Papers

  • Full Paper Submission Date

    1st Call May 5th
    2nd Call May 31th

  • Notification of Acceptance

    July 1th

  • Camera Ready Submission

    July 20th

  • Author registration deadline

    July 20th

  • Oral presentations

    August 20th to 22th

Registration & Fees for INTERCON 2025 Participants

Committed to sharing knowledge, we offer you a special price for purchasing your pass in advance.

Category Early Registration
Valid from May 1st to June 30st, 2025
Late Registration
Valid from July 1st to August 20st, 2025
Attendee Payment
IEEE RNR Participants S/ 150.00 S/ 168.00 Make Payment
IEEE Student Member S/ 260.00 S/ 280.00 Make Payment
Student S/ 300.00 S/ 320.00 Make Payment
IEEE Professional Member S/ 400.00 S/ 420.00 Make Payment
Professional S/ 460.00 S/ 480.00 Make Payment

The registration as a participant includes:

Registration kit.

Attendance at various workshops (limited spaces)

Accommodation for the days of the event (limited spaces)

Attendance to all conferences

Participation at the sports morning (limited spaces)

Certificate of participation in the event

Attendance to the various contests

Food for the three days (lunch)

Contact Us

Address

Universidad Católica Santa María de Arequipa, Urb. San José s/n Umacollo Arequipa - Perú

Call Us

+51 933 129 554

Email Us

intercon@ieee.org.pe

© Copyright 2025 - Intercon