Call for Paper

The conference welcomes original research papers written in English, with a length of 6 to 8 pages, including the abstract and references. Papers should follow the IEEE conference template, which can be downloaded from https://www.ieee.org/conferences/publishing/templates.html.

All accepted papers require authors to sign a copyright transfer for their content. The accepted papers will be indexed and published in the IEEE Xplore Digital Library.

Papers must be submitted in PDF format. Submissions are to be made electronically via EasyChair https://easychair.org/conferences/?conf=intercon2025

CALL FOR PAPERS

SUBMIT YOUR PAPER

PAPER TEMPLATE

Important Dates the Call for Papers

Full Paper Submission
Date

May 5th

May 31th

Notification of Acceptance

July 1th

Camera Ready Submission

July 20th

Author registration deadline

July 20th

Oral
presentations

August 20th to 22th

Details Topics

  • T1.Artificial Intelligence and Machine Learning

  • T2. Communications and Networking

  • T3. Power, Energy, and Power Electronics

  • T4. Biomedical Engineering & Healthcare Technologies

  • T5. Robotics, Control, Instrumentation, and Automation

  • T6. Multimedia Signal Processing and Analytics

  • T7. Devices, Circuits, and Materials

  • T8. Data Science and Computing Technologies

  • T9. Education in Engineering and Technology

  • T1.1. Foundation models and multimodal architectures.

  • T1.2. Small & efficient AI for edge computing.

  • T1.3. Autonomous learning: self-supervised and reinforcement learning.

  • T1.4. Responsible AI: ethics, transparency, and governance.

  • T1.5. Generative AI in industry.

  • T1.6. Machine Learning Ops (MLOps).

  • T1.7. Security in AI systems.

  • T1.8. Computer vision with deep learning.

  • T1.9. Multilingual natural language processing.

  • T1.10. AI in education and science.

  • T2.1. 6G networks

  • T2.2. Software-defined networking (SDN) and NFV

  • T2.3. Cybersecurity in network infrastructures

  • T2.4. Internet of Things (IoT)

  • T2.5. Autonomous networks with artificial intelligence

  • T2.6. Quantum networking

  • T2.7. Sustainability in telecommunications

  • T3.1. Power electronics for renewable energy.

  • T3.2. Smart grids and microgrids.

  • T3.3. Energy storage: batteries and supercapacitors.

  • T3.4. Power electronics in electric mobility.

  • T3.5. Power quality and harmonic mitigation.

  • T3.6. HVDC (high-voltage direct current) systems.

  • T3.7. Digital control in power electronics.

  • T3.8. Sustainability and energy transition.

  • T4.1. Tissue engineering and bioprinted organs.

  • T4.2. Wearable biomedical devices and smart implants.

  • T4.3. Artificial intelligence in medical diagnostics.

  • T4.4. Telemedicine and remote patient monitoring.

  • T4.5. Neuroengineering and brain-computer interfaces.

  • T4.6. Surgical robotics and medical automation.

  • T4.7. Advanced biomaterials for clinical applications.

  • T4.8. Big data in healthcare and personalized medicine.

  • T4.9. Genetic engineering and cell therapies.

  • T4.10. Data security and privacy in healthcare systems.

  • T5.1. Autonomous robotics and intelligent navigation.

  • T5.2. Adaptive and robust control of dynamic systems.

  • T5.3. Industry 4.0 automation.

  • T5.4. Smart instrumentation and advanced sensors.

  • T5.5. Cyber-physical systems and real-time control.

  • T5.6. Collaborative robotics (cobots) in industry.

  • T5.7. Machine vision for robotics.

  • T5.8. Autonomous land and aerial vehicles (drones).

  • T5.9. Model predictive control (MPC).

  • T5.10. AI integration in automated control systems.

  • T6.1. Audio and speech signal processing with AI.

  • T6.2. Real-time image and video analysis.

  • T6.3. Advanced multimedia coding and compression.

  • T6.4 Pattern recognition in biometric signals.

  • T6.5. Multisensor data fusion.

  • T6.6. Deep learning applied to multimedia signals.

  • T6.7. Sentiment and emotion analysis in audio and video.

  • T6.8. 3D spatial and acoustic signal processing.

  • T6.9. Intelligent streaming and bandwidth optimization.

  • T6.10. Anomaly detection in multimedia signals.

  • T7.1. Analog and digital integrated circuit design.

  • T7.2. Flexible electronics and wearable devices.

  • T7.3. Advanced semiconductor materials (GaN, SiC).

  • T7.4. Nanoelectronic devices and nanotechnology.

  • T7.5. MEMS and NEMS for sensors and actuators.

  • T7.6. High-efficiency power electronics.

  • T7.7. New materials for sustainable electronics.

  • T7.8. Optoelectronic and photonic devices.

  • T7.9. Heterogeneous system integration (SoC, SiP).

  • T7.10. Simulation and modeling of electronic devices.

  • T8.1. Data engineering and big data architectures.

  • T8.2. Data science applied to social and health challenges.

  • T8.3. Data mining and pattern discovery.

  • T8.4. Interactive data visualization.

  • T8.5. Cloud computing and serverless computing.

  • T8.6. Edge computing for real-time data processing.

  • T8.7. High-performance computing (HPC).

  • T8.8. Data governance, privacy, and ethics.

  • T8.9. NoSQL and real-time databases.

  • T8.10. AI integration with automated data pipelines.

  • T9.1. Digital transformation in engineering education.

  • T9.2. Active methodologies: project- and problem-based learning.

  • T9.3. Integration of emerging technologies into the curriculum.

  • T9.4. Inclusive education and accessibility in digital environments.

  • T9.5. Assessment of learning in virtual settings.

  • T9.6. Development of digital skills in teachers and students.

  • T9.7. Virtual labs and simulations in technical education.

  • T9.8. Gamification and immersive learning in engineering.

  • T9.9. International collaboration in engineering programs.

  • T9.10. Ethics and social responsibility in engineering training.

Author Registration fees

IEEE Student Member $ 354.00
Student $ 472.00
IEEE Professional Member $ 472.00
Professional $ 590.00

Author Fee Policy – Intercon 2025

Registration for INTERCON 2025, which will be held in person in Arequipa, Peru, includes one (01) paper per author. If the same author wishes to register a second paper, a 30% discount will be applied to the base fee. The discounted price is listed in the “2nd Paper Price” column.


Each author may register a maximum of two (02) papers.


For more information, please contact: intercon@ieee.org.pe
(*)An official proof of current enrollment is required to access student rates. Registration includes full access to the on-site conference as an attendee.