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INTERCON 2024

ORGANIZERS

Our Partners

Featuring esteemed institutions and innovative companies at the forefront of technology and research.

OFFICIAL PROGRAM

Important Dates Call For paper

Extended Full paper submission

August 15, 2023

Notification

September 25, 2023

Camera-ready

October 12, 2023

Author registration deadline

October 12, 2023

Call for Papers

INTERCON (IEEE Peru Section conference) is a renowned IEEE international technical conference which has been conducted in the Peru Section, to bring exciting discoveries, knowledge & understanding together. INTERCON 2023 is the XXX version of the conference and has been themed inspired by the IEEE Future Directions platforms. Year 2023’s INTERCON is co-organized by UPC (Universidad Peruana de Ciencias Aplicadas) jointly to its IEEE UPC Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2023 will continue the footsteps of its predecessors, to serve as a great platform for researchers to discuss and explore advanced technologies in advancing humanity.

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Organizers, Collaborators, and Sponsors

Organizers

IEEE
Peru Section
Technical and Financial Sponsor

Universidad Peruana de Ciencias Aplicadas
Venue of conference

IEEE
Student Branch
Technical Sponsor

Golden

Silver

Partnertship

Contacts

  • USIL ,La Molina , Lima , Perú
  • August 07 a 09 (9:00am - 8:00pm)
  • +51 933 129 554
  • informes@ieee.org.pe
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INTERCON 2024– XXXI International Conference on Electronics, Electrical Engineering and Computing
© INTERCON 2024