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The XXX International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.

Important Dates Call For paper

Extended Full paper submission

August 15, 2023


September 25, 2023


October 12, 2023

Author registration deadline

October 12, 2023

Call for Papers

INTERCON (IEEE Peru Section conference) is a renowned IEEE international technical conference which has been conducted in the Peru Section, to bring exciting discoveries, knowledge & understanding together. INTERCON 2023 is the XXX version of the conference and has been themed inspired by the IEEE Future Directions platforms. Year 2023’s INTERCON is co-organized by UPC (Universidad Peruana de Ciencias Aplicadas) jointly to its IEEE UPC Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2023 will continue the footsteps of its predecessors, to serve as a great platform for researchers to discuss and explore advanced technologies in advancing humanity.


Organizers, Collaborators, and Sponsors


Peru Section
Technical and Financial Sponsor

Universidad Peruana de Ciencias Aplicadas
Venue of conference

Student Branch
Technical Sponsor

INTERCON 2023 – XXX International Conference on Electronics, Electrical Engineering and Computing


  • UPC, Lima, Peru
  • +51 933 129 554