INTERCON (IEEE Peru Section conference) is a renowned IEEE international technical conference which has been conducted in the Peru Section, to bring exciting discoveries, knowledge & understanding together. INTERCON 2023 is the XXX version of the conference and has been themed inspired by the IEEE Future Directions platforms. Year 2023’s INTERCON is co-organized by UPC (Universidad de Ciencias Aplicadas) jointly to its IEEE UPC Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2023 will continue the footsteps of its predecessors, to serve as a great platform for researchers to discuss and explore advanced technologies in advancing humanity.