2017 IEEE INTERCON-CALL FOR PAPERS
The IEEE XXIV International Congress on Electronics, Electrical Engineering and Computing – INTERCON 2017 invites you to submmit a full length original research contributions from engineering professionals from industries, R&D organizations, academic institutions, government departments and research scholars from across the world.
INTERCON 2017 will be held in the Imperial City of Cusco in Peru. Seductive, striking and natural, Cusco’s history lives in its streets, squares, valleys and towns. Stunning destinations and examples of fine engineering by Inca stonemasons can be seen in many attractive places such as Machu Picchu, the Inca jewel built with the wisdom of the ancient Peruvians in an ecological environment.
Full length original research contributions and review articles not exceeding four pages as per the IEEE double column format shall be submitted. The manuscript should contribute original research ideas, developmental ideas, analysis, findings, results, etc. The manuscript should not have been published in any journals/magazines or conference proceedings and not under review any of them. All the submitted manuscripts will be sent for peer review and the corresponding author will be notified the outcome of the review process.